| PART |
Description |
Maker |
| 21-0542 |
PACKAGE OUTLINE 12 BUMPS, WLP PKG, 0.4MM PITCH
|
Maxim Integrated Products
|
| 90-0171 |
PACKAGE LAND PATTERN, (U28) 4.4MM TSSOP
|
Maxim Integrated Products
|
| IRS21814M IRS21814MTRPBF |
High and Low Side driver in a 16 Lead MLPQ 4mm x 4mm package.
|
International Rectifier
|
| SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| AP2301BGN-HF AP2301BGN-HF-14 |
2.8 A, 20 V, 0.13 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| EL2223 EL2223C EL2223J EL2223CJ EL2223L/883B EL222 |
12-Bit, 3.3V, 130MSPS, CommLinkTM High Speed D/A Converter (TSSOP); Temperature Range: -40°C to 85°C; Package: 28-SOIC
Laser Diode Driver with Waveform Generator; Temperature Range: 0°C to 70°C; Package: 28-QFN T&R
12-Bit, 3.3V, 130MSPS, CommLinkTM High Speed D/A Converter (TSSOP); Temperature Range: -40°C to 85°C; Package: 28-TSSOP
High Speed Operational Amplifier
Dual, 500 MHz High Speed, Operational Amplifier
|
Elantec Semiconductor
|
| TO263 |
Package Outline
|
Global Mixed-mode Techn...
|
| SSOP-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT263 |
Package outline
|
NXP
Philips Semiconductors
|
| TQFN2X2-12 |
Package Outline
|
Global Mixed-mode Techn...
|
| SC70-3 SOT323 |
Package Outline
|
Global Mixed-mode Techn...
|
